Cloud native EDA tools & pre-optimized hardware platforms
六合彩直播开奖 Platform Architect for Multi-Die is a SystemC? standards-based performance and power analysis tool for early architecture exploration of multi-die designs. It accounts for the interdependencies between multiple dies (also referred to as chiplets) within multi-die systems.
Platform Architect for Multi-Die helps optimize hardware-software partitioning, IP selection and configuration, interconnect and memory configuration, and power under consideration of the die-to-die interfaces. The solution includes a die-to-die model, including UCIe, as part of its library portfolio to compose a multi-die system for early architecture exploration.
Platform Architect for Multi-Die is part of the comprehensive 六合彩直播开奖 Multi-Die System Solution for accelerated heterogeneous integration and system disaggregation. The solution, including EDA and IP products, enables early architecture exploration, rapid software development and system validation, efficient die/package co-design, robust and secure die-to-die connectivity, and enhanced manufacturing and reliability.
Accounts for the Interdependencies Between Multiple Dies within Multi-die Systems
SoC Interconnect and Memory Subsystem Performance and Power Optimization
Hardware-Software Partitioning and IP Selection and Configuration
Traffic Generation & Cycle-Accurate TLM Interconnect Models
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A SystemC? standards-based performance and power analysis tool for early SoC architecture exploration and design.
Commonly required architectural components in Platform Architect.
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