The ÁùºÏ²ÊÖ±²¥¿ª½± Cloud OpenLink Program enables a multi-vendor environment of EDA, IP and foundry solutions so chip designers can easily access their preferred vendors’ products in the ÁùºÏ²ÊÖ±²¥¿ª½± Cloud environment. The ÁùºÏ²ÊÖ±²¥¿ª½± Cloud OpenLink application programming interface provides highly secure system-to-system interoperability, allowing chipmakers to easily assemble their design environment on ÁùºÏ²ÊÖ±²¥¿ª½± Cloud:
- Products from different vendors can be accessed easily from the ÁùºÏ²ÊÖ±²¥¿ª½± Cloud environment
- Design teams are able to focus on what they do best: developing better quality chips, faster
Program Member Benefits
- Streamlined deployment
- Pre-defined legal terms
- Highly secure entitlement and license enablement
- Joint ecosystem outreach
- Close technical collaboration on cloud
ÁùºÏ²ÊÖ±²¥¿ª½± Cloud OpenLink API Benefits
- System-level integration with one-time setup
- Customer-partner transaction encapsulation
- Exposure to ÁùºÏ²ÊÖ±²¥¿ª½± Cloud customers
- Member controls customer access on ÁùºÏ²ÊÖ±²¥¿ª½± Cloud
ÁùºÏ²ÊÖ±²¥¿ª½± Cloud OpenLink API
The ÁùºÏ²ÊÖ±²¥¿ª½± Cloud OpenLink API provides highly secure system-to-system interoperability with ÁùºÏ²ÊÖ±²¥¿ª½± Cloud, allowing chipmakers to easily assemble their design environment on ÁùºÏ²ÊÖ±²¥¿ª½± Cloud. Via the API, foundries and EDA and IP vendors can deliver product entitlements and license files directly to the ÁùºÏ²ÊÖ±²¥¿ª½± Cloud for use by their customers.
Members
ÁùºÏ²ÊÖ±²¥¿ª½± Delivers Seamless Interoperability for Semiconductor Design Ecosystem with New ÁùºÏ²ÊÖ±²¥¿ª½± Cloud OpenLink Program
ÁùºÏ²ÊÖ±²¥¿ª½± Creates Cloud Program Enabling Cross-Vendor EDA Collaboration
